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المنزل > المنتجات > وسادة حرارية > TIF100-30-06S High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers

TIF100-30-06S High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers

تفاصيل المنتج

مكان المنشأ: فيتنام

اسم العلامة التجارية: Ziitek

إصدار الشهادات: RoHS

رقم الموديل: TIF100-30-06S

شروط الدفع والشحن

الحد الأدنى لكمية: 1000 قطعة

الأسعار: 0.1-10 USD/PCS

تفاصيل التغليف: 24*13*12 سم كرتون

وقت التسليم: 3-5 أيام عمل

شروط الدفع: تي/تي

القدرة على العرض: 100000 قطعة/يوم

احصل على أفضل سعر
إبراز:
اسم المنتجات:
وسادة حرارية عالية التوصيل للحرارة، وسادة حرارية مصنوعة من السيليكون، مصممة لتبريد معالجات الذكاء ال
صلابة:
65/45 شور 00
الكلمات الرئيسية:
الوسادة الحرارية
الجاذبية النوعية:
3.0g/cm³
عينة:
عينة مجانية
الموصلية الحرارية:
3.0 واط / مك
مواد:
مطاط السيليكون المملوء بالسيراميك
تصنيف اللهب:
94-V0
لون:
أبيض
طلب:
معالجات الذكاء الاصطناعي وخوادم الذكاء الاصطناعي
اسم المنتجات:
وسادة حرارية عالية التوصيل للحرارة، وسادة حرارية مصنوعة من السيليكون، مصممة لتبريد معالجات الذكاء ال
صلابة:
65/45 شور 00
الكلمات الرئيسية:
الوسادة الحرارية
الجاذبية النوعية:
3.0g/cm³
عينة:
عينة مجانية
الموصلية الحرارية:
3.0 واط / مك
مواد:
مطاط السيليكون المملوء بالسيراميك
تصنيف اللهب:
94-V0
لون:
أبيض
طلب:
معالجات الذكاء الاصطناعي وخوادم الذكاء الاصطناعي
TIF100-30-06S High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers

High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers

 

Product descriptions

 

The TIF®100-30-06S Series is awell-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent suface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

 

Features:


> High thermal conductivity 3.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®100-30-06S Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.2 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-30-06S High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers 0

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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