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المنزل > المنتجات > وسادة حرارية > TIF100L-3040-06 3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices

TIF100L-3040-06 3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices

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مكان المنشأ: فيتنام

اسم العلامة التجارية: Ziitek

إصدار الشهادات: RoHS

رقم الموديل: TIF100L 3040-06

شروط الدفع والشحن

الحد الأدنى لكمية: 1000 قطعة

الأسعار: 0.1-10 USD/PCS

تفاصيل التغليف: 24*13*12 سم كرتون

وقت التسليم: 3-5 أيام عمل

شروط الدفع: تي/تي

القدرة على العرض: 100000 قطعة/يوم

احصل على أفضل سعر
إبراز:
اسم المنتجات:
وسادات حشو الفجوات الحرارية 3.0W/MK مع الموصلية الحرارية وانخفاض التقلب للأجهزة الدقيقة
كثافة:
3.0g/cm³
الكلمات الرئيسية:
منصات حشو الفجوة الحرارية
نطاق سمك:
0.010 بوصة (0.25 مم) ~ 0.200 بوصة (5.0 مم)
صلابة:
65/40 شور 00
لون:
أبيض
الموصلية الحرارية:
3.0W/MK
تصنيف اللهب:
أول 94 فولت-0 (E331100)
مواد:
مطاط السيليكون المملوء بالسيراميك
طلب:
الأجهزة الدقيقة
اسم المنتجات:
وسادات حشو الفجوات الحرارية 3.0W/MK مع الموصلية الحرارية وانخفاض التقلب للأجهزة الدقيقة
كثافة:
3.0g/cm³
الكلمات الرئيسية:
منصات حشو الفجوة الحرارية
نطاق سمك:
0.010 بوصة (0.25 مم) ~ 0.200 بوصة (5.0 مم)
صلابة:
65/40 شور 00
لون:
أبيض
الموصلية الحرارية:
3.0W/MK
تصنيف اللهب:
أول 94 فولت-0 (E331100)
مواد:
مطاط السيليكون المملوء بالسيراميك
طلب:
الأجهزة الدقيقة
TIF100L-3040-06 3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices

3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices

 

 Product descriptions

  

The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.

 

Features
 
> Ultra low volatility of siloxane
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance
 
Applications
 
> Motor Controller (MCU)
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen

 

Typical Properties of TIF®100L 3040-06 Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness (Shore 00) 65 40 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
∑D3-D10(PPM) <100 GC-MS
Thermal conductivity 3.0W/m-K ASTM D5470
3.0W/m-K ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)


The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.

 

TIF100L-3040-06 3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

VIETNAM ZITEK TECHNOLOGYCOMPANYLIMITD is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

  

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